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Radially Staggered Bonding Technology
This new approach to fine-pitch integrated circuit bonding entails a new configuration of bonding pads on the die, dual-loop wire bonding, and a new leadframe design that minimizes wire lengths. The approach bypasses the usual obstacles to fine-pitch bonding that arise with the conventional in-line approach, thus providing appreciable die size and cost reductions with a minimal assembly cost penalty.
by Rajendra D. Pendse, Rita N. Horner, and Fan Kee Loh
 Article 6 - dec96a6.pdf
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