|
Implementation of Pad Circuitry for Radially Staggered Bond Pad Arrangements
One approach to pushing the limits of wire bonding pitch in IC packages is to use two rows of radially staggered bond pads. This paper discusses the design of pad circuitry to mesh with the radially staggered bond pad arrangement. A test chip that incorporates suitable test structures was designed, fabricated, packaged and tested to verify the viability of the approach.
by Rita N. Horner, Rajendra D. Pendse, and Fan Kee Loh
 Article 7 - dec96a7.pdf
This article is available in Adobe Acrobat format (PDF). To view this article you need to have Acrobat Reader 2.0 or later installed on your system. The Acrobat reader is available free of charge in Unix, Dos, Windows and Macintosh formats. You can download the reader from Adobe Systems (www.adobe.com)
|
|
